DDR4 Heir-Apparent Makes Progress | EE Times

The current paradigm has become increasingly complex, said Black, and HMC is a significant shift. It uses a vertical conduit called through-silicon via (TSV) that electrically connects a stack of individual chips to combine high-performance logic with DRAM die. Essentially, the memory modules are structured like a cube instead of being placed flat on a… Continue reading DDR4 Heir-Apparent Makes Progress | EE Times

The Memory Revolution | Sven Andersson | EE Times

In almost every kind of electronic equipment we buy today, there is memory in the form of SRAM and/or flash memory. Following Moores law, memories have doubled in size every second year. When Intel introduced the 1103 1Kbit dynamic RAM in 1971, it cost $20. Today, we can buy a 4Gbit SDRAM for the same… Continue reading The Memory Revolution | Sven Andersson | EE Times