Single-chip DIMM offers low-power replacement for sticks of RAM | ExtremeTech

Covering the evolution off desktop commodity computer technologies has been fun going back to the days of Computer Shopper. I used to look at all the different specs, and standards and technologies. We’ve gotten faster CPUS, graphics cards, PCI buses, hard drives and now Solid state disks instead of hard drives. What’s left to innovate? Well let’s take a look at the lowly Dynamic Random Access Memory chip shall we? Or more specifically how that chip is packaged up onto a circuit board the Dual Inline Memory Moducle (DIMM). Read On:

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A 256Kx4 Dynamic RAM chip on an early PC memor...
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Invensas, a subsidiary of chip microelectronics company Tessera, has discovered a way of stacking multiple DRAM chips on top of each other. This process, called multi-die face-down packaging, or xFD for short, massively increases memory density, reduces power consumption, and should pave the way for faster and more efficient memory chips.

via Single-chip DIMM offers low-power replacement for sticks of RAM | ExtremeTech.

Who says there’s no such thing as progress? Apart from the DDR memory bus data rates moving from DDR-3 to DDR-4 soon what have you read that was significantly different, much less better than the first gen DDR DIMMS from years ago? Chip stacking is de rigeur for manufacturers of Flash memory especially in mobile devices with limited real estate on the motherboards. This packaging has flowed back into the computer market very handily and has lead to small form factors in all the very Flash memory devices. Whether it be, Thumb drives, or aftermarket 2.5″ Laptop Solid State Disks or embedded on an mSATA module everyone’s benefiting equally.

Wither stacking of RAM modules? I know there’s been some efforts to do this again for the mobile device market. But any large scale flow back into the general computing market has been hard to see. I’m hoping this announcement Invensas is a real shipping product eventually and not an attempt to stake a claim on intellectual property that will take the form of lawsuits against current memory designers and manufacturers. Stacking is the way to go, even if it never can be used in say a CPU, I would think clock speeds and power savings requirements on RAM modules might be sufficient to allow some stacking to occur. And if the memory access speeds improve at the same time, so much the better.

Author: carpetbomberz

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