The current paradigm has become increasingly complex, said Black, and HMC is a significant shift. It uses a vertical conduit called through-silicon via (TSV) that electrically connects a stack of individual chips to combine high-performance logic with DRAM die. Essentially, the memory modules are structured like a cube instead of being placed flat on a motherboard. This allows the technology to deliver 15 times the performance of DDR3 at only 30% of the power consumption.
via DDR4 Heir-Apparent Makes Progress | EE Times.
Even though DDR4 memory modules have been around in quantity for a short time, people are resistant to change. And the need for speed, whether it’s SSD’s stymied by SATA-2 data throughput or being married to DDR4 ram modules, is still pretty constant. But many manufacturers and analysts wonder aloud, “isn’t this speed good enough?”. That is true to an extent, the current OSes and chipset/motherboard manufacturers are perfectly happy cranking out product supporting the current state of the art. But know one wants to be the first to continue to push the ball of compute speed down the field. At least this industry group is attempting to get a plan in place for the next gen DDR memory modules. With any luck this spec will continue to evolve and sampled products will be sent ’round for everyone to review.
Given changes/advances in the storage and CPUs (PCIe SSDs, and 15 core Xeons), eventually a wall will be hit in compute per watt or raw I/O. Desktops will eventually benefit from any speed increases, but it will take time. We won’t see 10% better with each generation of hardware. Prices will need to come down before any of the mainstream consumer goods manufacturers adopt these technologies. But as previous articles have stated the “time to idle” measurement (which laptops and mobile devices strive to achieve) might be reason enough for the tablet or laptop manufacturers to push the state of the art and adopt these technologies faster than desktops.
Related articles
Carpet Bomberz Inc. 